DIFFERENTIAL THERMOGRAVIMETRIC ANALYSIS OF THE ORGANOSILICON OLIGOMER
Keywords:
organosilicon oligomer, differential thermogravimetric analysis, TGA, DTG, thermal stability, decomposition stages, phenol–formaldehyde resin, Si–O–Si network.Abstract
This work presents the results of differential thermogravimetric (DTG) analysis of an organosilicon oligomer synthesized on the basis of metasilicic acid, phenol, and formaldehyde. The DTG and TGA curves reveal that the thermal degradation process occurs in three main stages. The first stage (26.20–242.89 °C) corresponds to the evaporation of physically adsorbed moisture and low-molecular-weight volatiles, resulting in a mass loss of 3.977%. The second stage (242.89–438.38 °C) represents the primary decomposition of the phenolic polymer network, with the most significant mass loss of 36.525%. The third stage (438.38–801.12 °C) is associated with the degradation of the siloxane network and residual carbonaceous char, resulting in a mass loss of 16.267%. After 450 °C, the mass change is negligible, indicating the high thermal stability of the material. The results confirm that the incorporation of organosilicon fragments into the phenolic resin matrix enhances thermal stability and increases residual char yield, making the material suitable for high-temperature applications.
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